Printed Electronics – the Missing Fragments
A major impediment to the commercialisation of printed electronics is the large footprint. For transistors, this is caused by the large feature size, for conductors by the poor conductance of the inks and for photovoltaics by the poor efficiency. It therefore comes as a surprise that few are working on the printing of one component on top of another because this would reduce overall footprint and improve reliability by eliminating conventional interconnects. There are therefore many sectors of printed electronics with little competition and great needs and most players would be wise to be profitably serving these as they watch the impending shakeout of OLED developers from a safe distance.
For the latest on all these opportunities attend Printed Electronics Europe 2007; held in Cambridge on 17-18 April. See www.IDTechEx.com/peEUROPE for more details.
By Dr Peter Harrop
For more information regarding this article please contact the author Dr. Peter Harrop at +44 (0)1256 862163 or email@example.com
IDTechEx 2007 Dates:
RFID Smart Labels USA 21-22 February, Boston, USA www.IDTechEx.com/USA
Printed Electronics Europe 17-18 April, Cambridge, UK www.IDTechEx.com/peEUROPE
RFID Smart Labels Europe and Active RFID Europe September, UK