PODi Receives Clemson University’s 2010 Corporate Appreciation Award
ROCHESTER, NY—April 1, 2010—PODi, the Digital Printing Initiative, is proud to be recognized by Clemson University’s Department of Graphic Communications with this year’s Corporate Appreciation Award, honoring companies which have contributed significantly to the welfare of this leading center for printing leadership. PODi was singled out for the opportunities it has made available for Clemson students to serve as conference interns at the PODi AppForum, where they are able to see digital print strategies in action, and make invaluable career connections with industry leaders. Awards were presented March 25, 2010 as part of the 5th annual Bill Treadway Print Leadership Forum at Clemson University in Clemson, South Carolina.
Dr. John Leininger, Professor of Graphic Communications at Clemson University, presented the award to Tracy Burkovich from PODi and told the audience, “PODi has given our students a unique opportunity to interact with the proactive printers that attend the PODi AppForum. The students make contacts that have helped them find successful careers in the print and cross media segments of the industry. During one AppForum two students interviewed with a vendor company and the next year they were working the table for that vendor at the Forum. This has been a win, win, win, win relationship (a win for the students, Clemson, PODi and the industry) and we thank PODi for the continued support.”
Over the past five years, Clemson students have taken an active part in PODi’s AppForum, a 3-day, educational event focused on digital print. Conference interns create displays, prepare conference spaces, and work closely with speakers, assisting with presentation set up and monitoring schedules. They help attendees register, answer questions, and are vital to assuring the event moves smoothly. Because the AppForum attracts the top innovators and executives in the digital print world, conference interns are afforded unique learning and networking opportunities.