Heidelberg Hosts Successful LPIA Spring Technical ConferenceMarch 15, 2012
On the finishing side, participants saw the most advanced high-speed POLAR P.A.C.E. cutting system (POLAR Automation for Cutting Efficiency), recipient of a 2008 PIA InterTech Technology award. Also featured were label-cutting equipment built around the DC-M and DC-11 high-die and SC-21 square-cutting systems displayed in various configurations for efficient manufacturing. Of special interest to attendees were POLAR P-Net and Compucut networking technologies, demonstrating state-of-the-art postpress data communication. The KAMA ProCut 74F die cutter with hot foil and finishing and ProFold 74 folder-gluer were shown with an emphasis on value-added features like embossing, debossing, foiling, plastic cutting, gluing, and specialty applications.
In consultation with Heidelberg experts, participants also were encouraged to explore new brand-building processes, markets and brand applications, as well as new capabilities developed to address the growing demands of the exploding marketplace for packaging, label and specialty printing.
“Printing and converting is a capital-intensive business,” Iovoli noted. “Companies that fail to invest and reinvest also will fail to compete effectively. Kudos to both Heidelberg and HP for giving us the benefit of their insight and expertise.”
Heidelberg is your one-stop shop for a complete packaging solution, from entry-level to high-performance prepress, press and postpress equipment; vertical services including Prinect integration and color management; maintenance and repair; customized training options; performance optimization; and a comprehensive portfolio of consumable products. To learn more, visit www.heidelberg.com. Many of these products and services are on display in Heidelberg’s North American Print and Packaging Technology Center in Kennesaw, GA. To schedule a demo, call 1-888-472-9655, prompt 2.